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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2444090-3CONN SOCKET SIP 16POS GOLD |
9,724 |
|
Datasheet |
- | Bulk | Active | SIP | 16 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
|
2444090-5CONN SOCKET SIP 20POS GOLD |
6,914 |
|
Datasheet |
- | Bulk | Active | SIP | 20 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
|
2485267-1DIP IC SOCKET 6P,GOLD FLASH-SMD |
10,800 |
|
Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
2485267-2DIP IC SOCKET 8P,GOLD FLASH-SMD |
10,794 |
|
Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
2485267-3DIP IC SOCKET 10P,GOLD FLASH-SMD |
10,800 |
|
Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
2485267-4DIP IC SOCKET 12P,GOLD FLASH-SMD |
10,798 |
|
Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
ICF-308-T-I-TR.100" SURFACE MOUNT SCREW MACHIN |
1,900 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
05-0518-00CONN SOCKET SIP 5POS GOLD |
1,770 |
|
Datasheet |
518 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
115-47-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
2,134 |
|
Datasheet |
115 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
2445893-1DIP IC SOCKET 8P SMT |
9,000 |
|
Datasheet |
- | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
|
SMPX-32LCC-NSMT PLCC SOCKET 32P NON POLARISE |
358 |
|
Datasheet |
SMPX | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -50°C ~ 105°C |
|
2444090-1CONN SOCKET SIP 10POS GOLD |
3,396 |
|
Datasheet |
- | Bulk | Active | SIP | 10 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | - |
|
2485264-5DIP IC SOCKET 18P,SN |
11,440 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
8420-21A1-RK-TPCONN SOCKET PLCC 20POS TIN |
5,616 |
|
Datasheet |
8400 | Tube | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
2485264-2DIP IC SOCKET 14P-SN |
15,282 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
2444090-4SIP IC SKT 20 AU0.75 |
2,242 |
|
Datasheet |
- | Tray | Active | SIP | 20 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
2485264-6DIP IC SOCKET 20P,SN |
10,456 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
2485264-3DIP IC SOCKET 16P,SN |
13,038 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
8420-21B1-RK-TRCONN SOCKET PLCC 20POS TIN |
2,572 |
|
Datasheet |
8400 | Tape & Reel (TR) | Active | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
214-44-308-01-670799STANDRD SOLDER TAIL DIP SOCKET |
2,000 |
|
Datasheet |
214 | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
