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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    111-47-308-41-001000

    111-47-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,396
    RFQ
    		111-47-308-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-314-SGG

    ICA-314-SGG

    CONN IC DIP SOCKET 14POS GOLD

    Samtec Inc.

    		 9,322
    RFQ
    		ICA-314-SGG

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    115-43-318-41-003000

    115-43-318-41-003000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 438
    RFQ
    		115-43-318-41-003000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-328-41-001000

    110-41-328-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 360
    RFQ
    		110-41-328-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-320-41-001000

    115-93-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 436
    RFQ
    		115-93-320-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-320-41-001000

    111-93-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 340
    RFQ
    		111-93-320-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    214-99-632-01-670800

    214-99-632-01-670800

    CONN IC DIP SOCKET 32POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 2,930
    RFQ
    		214-99-632-01-670800

    Datasheet

         		214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-628-T-O

    ICF-628-T-O

    CONN IC DIP SOCKET 28POS TIN

    Samtec Inc.

    		 466
    RFQ
    		ICF-628-T-O

    Datasheet

         		ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    111-43-324-41-001000

    111-43-324-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 402
    RFQ
    		111-43-324-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-324-41-001000

    111-93-324-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 270
    RFQ
    		111-93-324-41-001000

    Datasheet

         		111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-624-41-001000

    111-93-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 220
    RFQ
    		111-93-624-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-3518-101

    14-3518-101

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 276
    RFQ
    		14-3518-101

    Datasheet

         		518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-43-328-41-001000

    115-43-328-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 388
    RFQ
    		115-43-328-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-628-T-O-TR

    ICF-628-T-O-TR

    CONN IC DIP SOCKET 28POS TIN

    Samtec Inc.

    		 500
    RFQ
    		ICF-628-T-O-TR

    Datasheet

         		ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    214-99-640-01-670800

    214-99-640-01-670800

    CONN IC DIP SOCKET 40POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 308
    RFQ
    		214-99-640-01-670800

    Datasheet

         		214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-628-41-001000

    111-93-628-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 392
    RFQ
    		111-93-628-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-308-S-O

    ICF-308-S-O

    CONN IC DIP SOCKET 8POS TIN

    Samtec Inc.

    		 9,564
    RFQ
    		ICF-308-S-O

    Datasheet

         		ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    115-93-632-41-003000

    115-93-632-41-003000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 242
    RFQ
    		115-93-632-41-003000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    08-2503-30

    08-2503-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 242
    RFQ
    		08-2503-30

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    115-93-632-41-001000

    115-93-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,612
    RFQ
    		115-93-632-41-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 2728293031323334...955Next»
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