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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    514-83-352M26-001148

    514-83-352M26-001148

    CONN SOCKET BGA 352POS GOLD

    Preci-Dip

    		 4,578
    RFQ
    		514-83-352M26-001148

    Datasheet

         		514 Bulk Active BGA 352 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-456M26-001148

    514-87-456M26-001148

    CONN SOCKET BGA 456POS GOLD

    Preci-Dip

    		 2,934
    RFQ
    		514-87-456M26-001148

    Datasheet

         		514 Bulk Active BGA 456 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3574-16

    24-3574-16

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 6,936
    RFQ
    		24-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-478M26-131166

    550-10-478M26-131166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    		 7,876
    RFQ
    		550-10-478M26-131166

    Datasheet

         		550 Bulk Active BGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    28-3571-16

    28-3571-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 8,574
    RFQ
    		28-3571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    28-3572-16

    28-3572-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 9,242
    RFQ
    		28-3572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    28-3573-16

    28-3573-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 2,494
    RFQ
    		28-3573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    28-3574-16

    28-3574-16

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    		 6,738
    RFQ
    		28-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6572-16

    28-6572-16

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 8,216
    RFQ
    		28-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6574-16

    28-6574-16

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 2,860
    RFQ
    		28-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    510-91-400-20-000001

    510-91-400-20-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,658
    RFQ
    		510-91-400-20-000001

    Datasheet

         		510 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-83-356M26-001148

    514-83-356M26-001148

    CONN SOCKET BGA 356POS GOLD

    Preci-Dip

    		 7,710
    RFQ
    		514-83-356M26-001148

    Datasheet

         		514 Bulk Active BGA 356 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-480M29-001166

    550-10-480M29-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    		 9,574
    RFQ
    		550-10-480M29-001166

    Datasheet

         		550 Bulk Active BGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-357M19-001148

    514-83-357M19-001148

    CONN SOCKET BGA 357POS GOLD

    Preci-Dip

    		 6,742
    RFQ
    		514-83-357M19-001148

    Datasheet

         		514 Bulk Active BGA 357 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-292M20-001106

    518-77-292M20-001106

    CONN SOCKET PGA 292POS GOLD

    Preci-Dip

    		 2,986
    RFQ
    		518-77-292M20-001106

    Datasheet

         		518 Bulk Active PGA 292 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    28-3570-16

    28-3570-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 8,708
    RFQ
    		28-3570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    28-6570-16

    28-6570-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 8,586
    RFQ
    		28-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    28-6571-16

    28-6571-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 6,800
    RFQ
    		28-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    28-6573-16

    28-6573-16

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 6,248
    RFQ
    		28-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    50-9508-21

    50-9508-21

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    		 8,840
    RFQ
    		50-9508-21

    Datasheet

         		508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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