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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    85-PGM11007-10H

    85-PGM11007-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,038
    RFQ
    		85-PGM11007-10H

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-652-61-003000

    116-93-652-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,264
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-648-61-007000

    116-93-648-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 7,208
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0930-G-R

    APH-0930-G-R

    APH-0930-G-R

    Samtec Inc.

    		 5,244
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1430-G-R

    APH-1430-G-R

    APH-1430-G-R

    Samtec Inc.

    		 2,598
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0530-G-R

    APH-0530-G-R

    APH-0530-G-R

    Samtec Inc.

    		 3,258
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1030-G-R

    APH-1030-G-R

    APH-1030-G-R

    Samtec Inc.

    		 6,502
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1630-G-R

    APH-1630-G-R

    APH-1630-G-R

    Samtec Inc.

    		 4,732
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0730-G-R

    APH-0730-G-R

    APH-0730-G-R

    Samtec Inc.

    		 2,156
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1130-G-R

    APH-1130-G-R

    APH-1130-G-R

    Samtec Inc.

    		 2,584
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0830-G-R

    APH-0830-G-R

    APH-0830-G-R

    Samtec Inc.

    		 4,456
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0230-G-R

    APH-0230-G-R

    APH-0230-G-R

    Samtec Inc.

    		 4,528
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0330-G-R

    APH-0330-G-R

    APH-0330-G-R

    Samtec Inc.

    		 7,272
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1730-G-R

    APH-1730-G-R

    APH-1730-G-R

    Samtec Inc.

    		 4,774
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    123-13-952-41-001000

    123-13-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 8,058
    RFQ
    		123-13-952-41-001000

    Datasheet

         		123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-964-61-105000

    110-43-964-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 7,970
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-3553-11

    48-3553-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 5,680
    RFQ
    		48-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-950-61-006000

    116-93-950-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,490
    RFQ

    -

    		 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6508-211

    40-6508-211

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 9,406
    RFQ
    		40-6508-211

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6508-311

    40-6508-311

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 5,562
    RFQ
    		40-6508-311

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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