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IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
243-28-1-06

243-28-1-06

CONN IC DIP SOCKET 28POS TIN

CNC Tech

3,048
RFQ
243-28-1-06

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
1-2199298-6

1-2199298-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

4,946
RFQ
1-2199298-6

Datasheet

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
D01-9970242

D01-9970242

CONN SOCKET SIP 2POS GOLD

Harwin Inc.

32,064
RFQ
D01-9970242

Datasheet

D01-997 Bag Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Threaded - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2C-0311-N

XR2C-0311-N

CONN SOCKET SIP 3POS GOLD

Omron Electronics Inc-EMC Div

7,308
RFQ
XR2C-0311-N

Datasheet

XR2 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
245-24-1-06

245-24-1-06

CONN IC DIP SOCKET 24POS TIN

CNC Tech

4,120
RFQ
245-24-1-06

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-44-306-41-001000

110-44-306-41-001000

CONN IC DIP SOCKET 6POS TIN

Mill-Max Manufacturing Corp.

3,402
RFQ
110-44-306-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 08-HZL/01-TT

AR 08-HZL/01-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

13,790
RFQ
AR 08-HZL/01-TT

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
D01-9970642

D01-9970642

CONN SOCKET SIP 6POS GOLD

Harwin Inc.

56,502
RFQ
D01-9970642

Datasheet

D01-997 Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 20-HZL-TT

AR 20-HZL-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

3,960
RFQ
AR 20-HZL-TT

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
245-28-1-06

245-28-1-06

CONN IC DIP SOCKET 28POS TIN

CNC Tech

2,136
RFQ
245-28-1-06

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
D01-9970542

D01-9970542

CONN SOCKET SIP 5POS GOLD

Harwin Inc.

5,186
RFQ
D01-9970542

Datasheet

D01-997 Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-1-08-003

210-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

5,854
RFQ
210-1-08-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
4808-3000-CP

4808-3000-CP

CONN IC DIP SOCKET 8POS TIN

3M

49,376
RFQ
4808-3000-CP

Datasheet

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
243-40-1-06

243-40-1-06

CONN IC DIP SOCKET 40POS TIN

CNC Tech

3,422
RFQ
243-40-1-06

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
4816-3000-CP

4816-3000-CP

CONN IC DIP SOCKET 16POS TIN

3M

22,360
RFQ
4816-3000-CP

Datasheet

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4814-3004-CP

4814-3004-CP

CONN IC DIP SOCKET 14POS TIN

3M

19,682
RFQ
4814-3004-CP

Datasheet

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4814-3000-CP

4814-3000-CP

CONN IC DIP SOCKET 14POS TIN

3M

17,594
RFQ
4814-3000-CP

Datasheet

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
SA103000

SA103000

CONN IC DIP SOCKET 10POS GOLD

On Shore Technology Inc.

7,952
RFQ
SA103000

Datasheet

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
110-99-308-41-001000

110-99-308-41-001000

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

4,022
RFQ
110-99-308-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-2199298-8

1-2199298-8

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

2,476
RFQ
1-2199298-8

Datasheet

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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