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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-650-41-006000

    116-43-650-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 8,028
    RFQ
    		116-43-650-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0530-T-H

    APH-0530-T-H

    APH-0530-T-H

    Samtec Inc.

    		 6,156
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1530-T-H

    APH-1530-T-H

    APH-1530-T-H

    Samtec Inc.

    		 4,696
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1130-T-H

    APH-1130-T-H

    APH-1130-T-H

    Samtec Inc.

    		 3,010
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1730-T-H

    APH-1730-T-H

    APH-1730-T-H

    Samtec Inc.

    		 6,968
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1630-T-H

    APH-1630-T-H

    APH-1630-T-H

    Samtec Inc.

    		 7,808
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1330-T-H

    APH-1330-T-H

    APH-1330-T-H

    Samtec Inc.

    		 8,134
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1230-T-H

    APH-1230-T-H

    APH-1230-T-H

    Samtec Inc.

    		 7,252
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    714-43-234-31-018000

    714-43-234-31-018000

    CONN IC DIP SOCKET 34POS GOLD

    Mill-Max Manufacturing Corp.

    		 9,862
    RFQ
    		714-43-234-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-636-31-018000

    614-93-636-31-018000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    		 9,548
    RFQ
    		614-93-636-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-636-31-018000

    614-43-636-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 8,160
    RFQ
    		614-43-636-31-018000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-C182-20

    28-C182-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,152
    RFQ
    		28-C182-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C182-30

    28-C182-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 8,284
    RFQ
    		28-C182-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C212-20

    28-C212-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 8,966
    RFQ
    		28-C212-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C212-30

    28-C212-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 9,976
    RFQ
    		28-C212-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C300-20

    28-C300-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,986
    RFQ
    		28-C300-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C300-30

    28-C300-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 9,004
    RFQ
    		28-C300-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-432-41-004000

    612-41-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,062
    RFQ
    		612-41-432-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-632-41-004000

    612-41-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 7,302
    RFQ
    		612-41-632-41-004000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-432-41-004000

    612-91-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 6,324
    RFQ
    		612-91-432-41-004000

    Datasheet

         		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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